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| 超鮮職缺 | 工作內容 | 需求學歷 | 工作地點 | |
|---|---|---|---|---|
2026 Server Mechanical Engineer Summer Intern (R272888, R272889) | **歡迎身心障礙者投遞履歷 2026 Server Mechanical Engineer Summer Intern Mechanical Engineering leads and delivers the development of innovative and compliant mechanical design solutions, as well as cross-functional interfaces for general purposes, storage and AI server systems. Our team conducts the analysis, feasibility studies and testing of mechanical products, instruments and sub-assemblies for new and existing products – and then oversees the introduction of design changes to the manufacturing organizations. Ready to develop your career in a truly global and collaborative company? Join us as a Server Mechanical Engineer Summer Intern on our Infrastructure Solutions Group Mechanical Engineering Development team in Taipei to do the best work of your career and make a profound social impact. What you’ll achieve As a Server Mechanical Engineer Summer Intern, you will design, document, and functionally validate mechanical components and assemblies, as well as participate in engineering tests to validate the robustness and proper performance of new products. You will: ME Contribute ideas to drive the innovative mechanical design solutions for server products Join and provide constructive feedback on project technical discussion Design, document and monitor the validation and qualification of a pre- selected sub-project on either components or assemblies with moderate supervision Ensures deliverables are met pre-selected sub-project program schedules Have chance to interfaces with suppliers, electrical engineering, manufacturing, quality, tooling engineering and other development groups to ensure the successful development the sub-project Thermal Join to develop thermal solutions for server products through engaging with different stakeholders, such as cross-functional teams, ODMs, and suppliers Analyze testing data and find out the optimized solution Learn to do issue debugging and drive the root cause out Be proactively collaborated with other teams and provide comprehensive deliverables Take the first step towards your dream career Every Dell Technologies team member brings something unique to the table. Here’s what we are looking for with this role: Essential Requirements Hold active student identity in Bachelor or master's program in Mechanical or Automation Control Engineering and will graduate in 2026/2027; can fully attend the internship between 2026/6/23 to 2026/8/21 Fluency in English communication with strong communication/presentation skills. ME Mechanical aptitude for interpretation of mechanical drawing specifications; experience of using CAD tools. Knowledge and understanding of manufacturing-driven design issues. Ability to read and understand technical data sheets. Thermal Fundamental thermal and electrical cooling knowledge, including CAE/Simulation tool and empirical tests Data analysis and root cause analysis with logical thinking Desirable Requirements High interest in Mechanical or Thermal System Design in the IT industry. Understanding of using CAD and FEA tools or work experience in the Mechanical Design/ Thermal/ Reliability field would be a plus. Personality: Optimism, passion, integrity, and hungry to learn Application closing date: 10 May 2026 | 大學 | 台北市大安區 | 立即應徵 |
2026 Hardware Engineer Summer Intern of Client Solutions Group (ME) (R273193~R273195, R273197, R273198) | **歡迎身心障礙者投遞履歷 2026 Hardware Engineer Summer Intern of Client Solutions Group (ME) The reputation of Dell Technologies for delivering award-winning hardware is legendary and our Hardware Engineering team is at the heart of it. We design and develop analogue as well as digital hardware products – not just computer or network hardware devices but peripherals too. Recognized for our high level of technical expertise in a variety of engineering disciplines, we’re involved across the development lifecycle – from research to the building, testing and delivery of completed products. Innovators in our field, we lead the way in exploring new concepts, approaches, processes, materials and components. Join us as a Hardware Engineer Summer Intern on our Engineering Development team in Taipei to do the best work of your career and make a profound social impact. What you’ll achieve As a Hardware Engineer Summer Intern, you will be responsible for providing solutions to a variety of problems of certain scope and complexity while working with your supervisor and other professionals in immediate work group or department. You will Follow standard engineering practices and use tools appropriately with technical guidance Assist with design and development of engineering assignments related to hardware components as well as products and systems including the development of new products or updates to existing products Complete tasks and assignments encompassing one or more areas of engineering Develop awareness of cost targets established during the program design phase Take the first step towards your dream career Every Dell Technologies team member brings something unique to the table. Here’s what we are looking for with this role: Essential Requirements Enrolled in Master’s program in Mechanical Engineering or equivalent field and will graduate in 2026/2027; can fully attend the internship between 2026/6/23 to 2026/8/21 Mechanical aptitude with the ability to interpret technical drawings and specifications. Familiarity with CAD, CFD/FEA tools Strong interpersonal and communication skills for effective collaboration in a global team environment. Solid analytical and problem-solving abilities. Desirable Requirements Fluency in English Application closing date: 10 May 2026 | 大學 | 台北市大安區 | 立即應徵 |
2026 Hardware Engineer Summer Intern of Client Solutions Group (EE) (R273188~R273192) | **歡迎身心障礙者投遞履歷 2026 Hardware Engineer Summer Intern of Client Solutions Group (EE) The reputation of Dell Technologies for delivering award-winning hardware is legendary and our Hardware Engineering team is at the heart of it. We design and develop analogue as well as digital hardware products – not just computer or network hardware devices but peripherals too. Recognized for our high level of technical expertise in a variety of engineering disciplines, we’re involved across the development lifecycle – from research to the building, testing and delivery of completed products. Innovators in our field, we lead the way in exploring new concepts, approaches, processes, materials and components. Join us as a Hardware Engineer Summer Intern on our Engineering Development team in Taipei to do the best work of your career and make a profound social impact. What you’ll achieve As a Hardware Engineer Summer Intern, you will be responsible for providing solutions to a variety of problems of certain scope and complexity while working with your supervisor and other professionals in immediate work group or department. You will Follow standard engineering practices and use tools appropriately with technical guidance Assist with design and development of engineering assignments related to hardware components as well as products and systems including the development of new products or updates to existing products Complete tasks and assignments encompassing one or more areas of engineering Develop awareness of cost targets established during the program design phase Take the first step towards your dream career Every Dell Technologies team member brings something unique to the table. Here’s what we are looking for with this role: Essential Requirements Enrolled in Master’s program in Electrical Engineering or equivalent field and will graduate in 2026/2027; can fully attend the internship between 2026/6/23 to 2026/8/21 Electrical aptitude with the ability to interpret technical drawings and specifications. Schematic design/layout based on x86 architecture Strong interpersonal and communication skills for effective collaboration in a global team environment. Solid analytical and problem-solving abilities. Desirable Requirements Fluency in English Application closing date: 10 May 2026 | 大學 | 台北市大安區 | 立即應徵 |
2026/03/07 (六)
01:30-08:00
台灣大學 徵才博覽會































