台積電

台積電

歡迎志同道合的夥伴,一起加入台積

超鮮職缺工作內容需求學歷工作地點

2026 台積電校園徵才 2026 TSMC Campus Recruitment

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19032&source=104&tags=domestic+campus+2026_104 台積公司成立於1987年,率先開創了專業積體電路製造服務之商業模式,自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展,以此釋放全球半導體產業的創新。身為全球的企業公民,台積公司的營運範圍遍及亞洲、歐洲及北美,致力成為企業社會責任的行動者。2024年,台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術,為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 因為期待無限可能,所以選擇台積。 台積致力於營造具挑戰性、可以持續學習而又有樂趣的工作環境,提供同業平均水準以上的薪酬與福利。 加入台積,您將與世界一流的優秀夥伴共事,透過最先進的製程技術,成就改變世界的大事,所有突破與創新,都有一份我們的努力。 歡迎「志同道合」的你,透過本計畫提前完成""線上應徵""註冊履歷,符合資格者,將享有優先面試的機會唷! 如您對台積電2026校園徵才計畫感興趣,歡迎報名參加,以掌握台積趨勢、組織概況與求職撇步。 此外,我們特別為同學安排了校園徵才實體與線上說明會,歡迎踴躍報名參加,以便了解公司市場趨勢、組織概況,並掌握求職技巧! 報名連結:請點我 (採線上報名,報名成功後將由系統自動發送活動通知信件,可重複報名不同場次。) 請線上應徵此「校園徵才活動」,如您已有求職偏好職缺,再根據以下職位額外投遞2至4個職位。 ▋歡迎志同道合的夥伴,一起加入台積 ▋世界上的每一個夢,都由我們來圓夢 Join TSMC: Where Infinite Possibilities Await. At TSMC, we believe in creating a challenging, continuous learning, and enjoyable work environment. We offer competitive compensation and benefits that exceed industry averages. Join us, and you'll collaborate with world-class talent, leveraging the most advanced process technologies to achieve breakthroughs that change the world. Every innovation and advancement carry the mark of our dedication. Are you ready to make an impact? We invite like-minded individuals to pre-register and submit resumes online through the 2026 Campus Recruitment Program. Qualified applicants will receive priority interview opportunities! We are organizing both on-campus recruitment and online information sessions. We encourage you to sign up for the upcoming events to gain insights into the market trends, organizational overview, and master essential interview skills. Registration Link: Please refer to career website (Pre-registration is required – After registration, you will receive an email notification sent by the system afterwards. You may register for multiple sessions.) Please apply online for this Campus Recruitment Event. If you already have preferred job openings, you may additionally apply for 2 to 4 positions from the list below on career site. 2026 台積電校園熱門職缺 TSMC Campus Recruitment Hot Jobs : R&D (研究與發展組織)  1-1 Research and Development Engineer (R&D)  1-2 Design and Technology Platform Engineer (DTP)  1-3 Specialty Engineer (Specialty)  1-4 Integrated Interconnect and Packaging Engineer (IIP) Operations (營運組織)  2-1 Process Integration Engineer (PIE)  2-2 Process Engineer (PE)  2-3 Equipment Engineer (EQ)  2-4 Intelligent Manufacturing Engineer (IMC/MFG)  2-5 Facility Engineer (FAC)  2-6 Product Engineer (PE)  2-7 Advanced Packaging Technology & Service Engineer (APTS)  2-8 Quality & Reliability Engineer (Q&R)  2-9 Module Associate Engineer (MAE) 儲備模組副工程師  2-10 Technician 技術員 Corporate Business (策略暨支援組織)  3-1 Information Technology (IT)  3-2 Corporate Planning Organization (CPO)  3-3 Materials Management (MM)  3-4 Human Resources (HR)  3-5 Finance, Accounting and Risk Management (FIN)

大學新竹縣寶山鄉 立即應徵

【2026 TSMC Campus Recruitment】Facility Engineer (FAC)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19041&source=104&tags=domestic+campus+2026_104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 廠務工程師為整合各項廠區資源,提供晶圓生產所需之電力、水、氣體、化學品、空調等,為台積高度智慧自動的生產單位,供應最高品質、最穩定的生產作業環境。近年廠務工程師更肩負環境保護與永續的責任,如何精進節水、節能、減碳、環保的廠務運轉技術,更是廠務工程師可以發揮專業與創意的主舞台。 1. Responsible for planning, constructing, operating, and maintaining semiconductor plant facility systems, including risk analysis of facility system operations and supply quality, allocating resources and energy, managing construction safety. 2. Provide a stable facility system, including power, water, gas, chemicals and HVAC, to meet wafer production requirements. 3. Collaborate with other departments to ensure that the facility system operates at the highest level of quality when on duty. 4. Construction management & project coordination. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

大學新竹縣寶山鄉 立即應徵

【2026 TSMC Campus Recruitment】Advanced Packaging Technology and Service Engineer (APTS)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19043&source=104&tags=domestic+campus+2026_104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: TSMC's advanced packaging process is an efficient and high-density packaging technology that mainly targets the demand for high-performance semiconductor components, including microprocessors, graphics processors, artificial intelligence chips, etc. This technology uses advanced 3D stacking technology to vertically stack multiple chips and uses high-density packaging materials to fix them together. This technology can improve the performance of components, reduce power consumption, reduce package size, and increase system integration. TSMC's packaging process includes various technologies such as CoWoS, InFO. Among them, CoWoS is a technology that connects different chips through copper wires through silicon interconnect technology to achieve high-frequency and high-speed data transmission. InFO technology directly encapsulates chips on the substrate, connecting chips and substrates through tiny copper wires, achieving a more compact and efficient packaging solution. TSMC's advanced packaging process can improve chip performance and production efficiency and meet the packaging technology requirements of modern high-performance electronic products, such as smartphones, artificial intelligence, high-performance computing, and other fields. TSMC's advanced packaging organization include Testing R&D Engineer conduct exploratory research in DFT test architecture, evaluating next-gen test technology of several device (logic SOC, HPC, AP, RF, etc.), which used 3D silicon stacking and advanced packaging technologies and closely teamwork with international customer from new product introduction to mass production. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

大學新竹縣寶山鄉 立即應徵

【2026 TSMC Campus Recruitment】Corporate Planning Organization (CPO)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19048&source=104&tags=domestic+campus+2026_104 Responsibilities: Our key responsibilities include: 1. We ensure customers' demands are well satisfied in the rapid market, win customer trust, enhance operation efficiency, and reach profit maximization. 2. We drive for business effectiveness to bring the world changing innovation into reality. 3. Our resources, production and demand planning, pricing, and system integration team develop flexible planning and provide quick responsiveness to coordinate needs between factories and customers. We seek individuals who meet the following criteria: 1. Possess experience in Business, Industrial Engineering, Computer Science, Information Systems, Information Science, or Semiconductor Industry. 2. Have skills in logical thinking and communication, learning agility, and business acumen. The following are detailed job descriptions: 1. Account PC Planner (1) Provide delivery schedule and logistic services to key customer. (2) Coordinate the internal planning team including planning team and backend for delivery. (3) Manage logistic service-related projects and Hub. 2. Fab Production Control Planner (1) Production control related systems initiate/ analyze. (2) Production control related data maintenance. (3) Project management. (4) Mask CLIP setting and delivery management. (5) Co-work with EBO/FPC/APC/Fab for mask support plan. 3. Fab Rationalization Engineer (1) Demand to supply rationalization, maximize capacity utilization. (2) Analyze product and new tape out portfolio for fab utilization effectiveness. (3) Provide FR proposals to optimize fab loading and customer's requirements. (4) Synergize demand planning and fab rationalization to maximize fab operational effectiveness and demand support. 4. Operation Resources Planning Engineer (1) Capacity planning and management. (2) Productivity improvement. (3) Capital investment evaluation and control. (4) Fab space layout planning. 5. DevOps Engineer (1) Collaborate with Users, Analyst and Architect on business needs and translate requirements into technical needs. (2) Identify and understand the data sources that are relevant for analysis. (3) Become a subject domain expert in company data especially for corporate planning. (4) Consolidate the requirements and use data engineering skills to design a robust DataMart. (5) Participate in design, architecture review and deployment of planning system and data warehouse solutions. (6) Design for automation and monitoring mechanism in a continuous integration environment. (7) Bring new technology with POC to solve existing business challenges. 6. ML/AI Engineer (1) Research and evaluate pioneering ML/DL/LLM methodologies to address business challenges. (2) Collaborate with engineering teams to conduct data exploration and build data pipelines. (3) Analyze and extract valuable information from vast amount of market data. (4) Implement prototypes and present results to stakeholders. 7. Corporate Planning Associate As an Associate, you will be rotated to a variety of roles in the 1st year to gain broad exposure to TSMC CPO. The rotation may cover several of following roles, operation resources planning, production planning, business operations, corporate pricing, advanced package supply chain solution, integrated & intelligent planning, and strategic platform intelligence. After successfully completing the rotation program, you will be placed in a role that matches your interests as well as fulfilling business needs. More CPO Associate Program Brochure, please refer to this link: https://careers.tsmc.com/careers/JobDetail/507/attachment/f933cb58-6ee7-40e2-b623-8f9800718e50

碩士新竹縣寶山鄉 立即應徵

【2026 TSMC Campus Recruitment】Information Technology (IT)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19047&source=104&tags=domestic+campus+2026_104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: You will be tasked with one or more of the following responsibilities: 1. Development and integration of Factory Automation Systems. 2. Development and integration of Advanced Technology. 3. Development and integration of Office Automation Systems. 4. Development and integration of Cloud Computing, Kubernetes or Big Data Analytics Systems. 5. Build/Development Scalable Platform for managing container applications. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

大學新竹縣寶山鄉 立即應徵

【2026 TSMC Campus Recruitment】技術員 Technician

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=19046&source=104&tags=Domestic+Campus+2026_104 台積公司成立於1987年,率先開創了專業積體電路製造服務之商業模式,自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展,以此釋放全球半導體產業的創新。身為全球的企業公民,台積公司的營運範圍遍及亞洲、歐洲及北美,致力成為企業社會責任的行動者。2024年,台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術,為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 Description 您可以根據所希望的工作地點和職務,投遞您的履歷到我們官網的以下職位: 1. 實驗室技術員 2. 南科電子束作業處技術員 3. 南科物流運籌系統部技術員 4. 高雄製造部技術員(12吋廠) 5. 高雄工程部技術員(12吋廠) 6. 嘉義物流運籌系統部技術員 7. 高雄物流運籌系統部技術員 8. 南科工程部技術員(12吋廠) 9. 南科先進封裝工程部技術員 10. 竹南先進封裝工程部技術員 11. 南科製造部技術員(12吋廠) 12. 嘉義先進封裝製造部技術員 13. 嘉義先進封裝工程部技術員 14. 南科先進封裝製造部技術員 營造一個合乎台積公司核心價值與經營理念的全球共融職場,對於公司未來成功至關重要。台積公司對全球共融職場的承諾,旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向,都能將其自身的觀點與經驗帶入工作,促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融,讓每一位員工都覺得被重視且有能力為企業使命提供貢獻,並為全球各戶提供卓越服務。

高中新竹縣寶山鄉 立即應徵

【2026 TSMC Campus Recruitment】Quality & Reliability Engineer (Q&R)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19044source=104&tags=domestic+campus+2026_104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 品質與可靠性工程師:為守護客戶產品不受任何缺陷影響,建立優良的產品品質與可靠度,以協助客戶在市場上搶得先機、強化競爭力;QR致力於開發領先全球的電子、物理、材料與化學等科學分析專業及可靠度統計量測方法,應用於我們的產線,確保從晶片設計、製程開發、產品量產到封裝測試等階段的品質及可靠度問題皆有完整的解決方案,同時提供最先進的材料與故障分析等服務,成為公司各組織、客戶以及供應商最信任的合作夥伴。 1. Quality and Reliability roles. 2. Failure & TEM analysis, Reliability data analysis with reliability modeling, manufacturing production quality management and reliability assessment, research, and development of new analysis methodology/technique. 3. Customers problem resolving production quality / reliability issues. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

碩士新竹縣寶山鄉 立即應徵

【2026 TSMC Campus Recruitment】Product Engineer (PE)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19042&source=104&tags=domestic+campus+2026_104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 加入台積電,成為產品工程師,你將有機會參與世界級先進製程技術,與頂尖團隊合作,挑戰技術極限!你將負責協助產品導入量產、提升良率,並確保產品符合客戶的最高標準。在這裡,你將學習到最先進的半導體技術,並為推動科技發展貢獻力量。我們的專業涵蓋非常廣,從成熟廠到先進廠、從邏輯產品到特殊應用甚至到封裝測試,能夠對產品有全面的了解與完整分析的能力。 1. Leading edge product development. Learn the most advanced technology in semiconductor manufacturing, identify effective process solution for yield and chip performance improvement. 2. Involving cross-team work for joint project development. Coordinate with customer/Fab/different support team closely to address improvement opportunities and work-out the solution. 3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue. 4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of "More than Moore". In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

碩士新竹縣寶山鄉 立即應徵

【2026 TSMC Campus Recruitment】Intelligent Manufacturing Engineer (IMC/MFG)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19040&source=104&tags=domestic+campus+2026_104 Responsibilities: 智慧製造工程師為創造晶圓產出最大化,滿足客戶交期,為公司帶來營收;身為工廠的第一線管理者,需掌握生產流程,藉由良好且精準派工提升機台生產效率,帶領技術員團隊確保製造流程順暢運行並達成每日的產能目標。 As a global semiconductor technology leader, TSMC is seeking an Intelligent Manufacturing Engineer to join our team. Our commitment to driving manufacturing excellence has led us to integrate artificial intelligence, machine learning, expert systems, and advanced algorithms to build up an intelligent manufacturing environment. Join TSMC, we are the most advanced technology team and connect with the world, as we head towards an unlimited future. We look forward to you joining us! You will be assigned to one of the following five roles according to your interest, experiences, and technical background. 1. MFG Intelligent Manufacturing Engineer As an Intelligent Manufacturing Engineer, you will be responsible for the development and maintenance of these intelligent manufacturing systems, which are widely used for scheduling and dispatching, employee productivity, equipment productivity, process and equipment control, quality defense, and robotic control. By optimizing quality, productivity, efficiency, and flexibility, you will play a crucial role in driving the success of our manufacturing operations. (1) Smart manufacturing engineers will learn leading artificial intelligence manufacturing technologies worldwide. (2) Big data analysis, improving production efficiency: Through data analysis, identify bottleneck machines and improve machine production efficiency. Breakthrough analysis and dispatching project system, optimize production resources and maximize manufacturing efficiency. (3) Machine learning, creating unlimited possibilities: Utilize cutting-edge machine learning technology to improve the production process and create innovative applications that achieve optimal scheduling and maximize wafer production capacity. 2. CIM Intelligent Manufacturing Engineer (1) Software Developers: Design and develop intelligent manufacturing solutions for factory automation, manufacturing scheduling and dispatching, decision making and engineering analysis. (2) Dispatching Algorithm Developers: Heterogeneous data integration and corresponding solution design and development. (3) Quality Management Engineer: Server maintenance and related setting support including routine upgrades, troubleshooting with AP teams, high-availability architecture, virtual machines solutions, firewall rule, IIS, Nginx, database middle etc. 3. Data Analyst & Data Scientist (1) Application of statistics, machine learning, data mining, pattern recognition and other data analysis by AI techniques. (2) Your main responsibility will be to collect, explore, and extract insights from very large scale structured and unstructured data and explain these insights with the help of data visualization tools to support fab operations. 4. AMHS (Automated Material Handling System) Engineer (1) AMHS (Software) system & AI development/(Hardware) layout design & transport simulation. (2) Enhance System Performance, Quality and Reliability. (3) Coordinate cross-organization AMHS projects. 5. PIDS/WAT (Wafer Acceptance Test) Engineer (1) New WAT tool data matching and release. (2) WAT quality/manufacturing efficiency improvement. (3) WAT tool, recipe, and system management. (4) WAT productivity and quality improvement. (5) WAT tool and systematic issue troubleshooting. 6. PIDS/NTO (New Tape Out) Engineer (1) Handle mask tape out and manufacturing flow creation. (2) Manage projects related to NTO system development and enhancement. 7. Quality Management Engineer (1) Manage audit, defense, and quality systems. (2) To perform data analysis and simulation.

碩士新竹縣寶山鄉 立即應徵

【2026 TSMC Campus Recruitment】Equipment Engineer (EQ)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19039&source=104&tags=domestic+campus+2026_104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 機台是工廠穩定運作的基礎,我們在生產線上,負責高端精密、高單價半導體設備的維護、保養並判斷、解決機台發生的問題;如此可減少機台當機的時間與提升機台可運轉的時間,進而降低生產成本並提升公司的獲利能力。 1. Master Nano Diffusion, Thin Film, Lithography, Etching, or Metrology equipment. 2. Sustain and troubleshoot issues with high-tech equipment. 3. Improve and enhance the efficiency and productivity of equipment. 4. Plan and execute the analysis or defect detection projects. 5. Communicate with cross-functional engineers or vendors. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

大學新竹縣寶山鄉 立即應徵

2026/03/16 (一)

07:30-08:30

屏科大 徵才說明會

2026/03/17 (二)

04:15-05:15

校園徵才說明會 中文專場1

2026/03/18 (三)

04:20-05:20

虎科 徵才說明會

2026/03/19 (四)

02:30-08:00

中正 校園徵才博覽會

2026/03/19 (四)

03:00-08:00

北科 校園徵才博覽會

2026/03/21 (六)

02:00-08:00

清大 校園徵才博覽會

2026/03/21 (六)

02:00-07:00

中興 校園徵才博覽會

2026/03/21 (六)

03:30-06:00

中興 徵才說明會(兩場次)

2026/03/22 (日)

01:30-07:30

中央 校園徵才博覽會

2026/03/23 (一)

04:15-05:15

徵才暨實習說明會 英文專場

2026/03/24 (二)

04:10-05:10

高師大 徵才說明會

2026/03/24 (二)

04:15-05:15

校園徵才說明會 商管專場

2026/03/25 (三)

02:00-08:00

高科建工校區 校園徵才博覽會

2026/03/25 (三)

03:30-04:30

雲科 徵才說明會

2026/03/26 (四)

04:15-05:15

校園徵才說明會 中文專場2

2026/03/26 (四)

10:30-11:30

臺師大公館校區 徵才說明會

2026/03/27 (五)

02:00-08:00

臺科 校園徵才博覽會

2026/03/15 (日)

02:00-07:00

成大 校園徵才博覽會

2026/03/14 (六)

02:00-08:00

中山 校園徵才博覽會

2026/03/14 (六)

02:00-08:00

陽明交大 校園徵才博覽會

2026/03/13 (五)

04:15-05:15

暑期實習 線上說明會

2026/03/10 (二)

02:00-08:00

逢甲 校園徵才博覽會

2026/03/07 (六)

01:30-08:30

臺大 校園徵才博覽會