職缺 | 工作內容 | 工作待遇 | 工作地點 | 加入我們 |
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韌體工程師 (2025新鮮人招募) | Here at Lenovo, we believe in smarter technology that builds a brighter, more sustainable, and inclusive future for our customers, colleagues, communities, and the planet. And we go big. No, not big—huge. We’re not just a US$70 billion revenue Fortune Global 500 company, we’re one of Fortune’s Most Admired. We’re transforming the world through intelligent transformation, offering the world’s most complete portfolio of smart devices, infrastructure, and solutions. With more than 71,500 employees doing business in 180 markets, we help millions—not just the select few—experience our version of a smarter future. The one missing thing? Well… you... We are looking for a Bachelor / Master's Degree graduate to join us which is the role responsibilities below : The person will have the opportunity to work with the x86 cutting-edge technology and its firmware development. Together with providing the WW customer in the General Purpose Team with a Basic Input/Output System (BIOS/UEFI) OR baseboard management controller (BMC) Requirements: - 在屆電機系,機電系,資訊工程系等相關科系的畢業生 - 熟悉C或C++程式開發 - 具備基本邏輯控制,硬體運作原理概念 | 月薪64,000~70,000元 | 台北市南港區 | |
訊號完整性工程師 (2025新鮮人招募) | Here at Lenovo, we believe in smarter technology that builds a brighter, more sustainable, and inclusive future for our customers, colleagues, communities, and the planet. And we go big. No, not big—huge. We' re not just a US$70 billion revenue Fortune Global 500 company, we’re one of Fortune’s Most Admired. We’re transforming the world through intelligent transformation, offering the world’s most complete portfolio of smart devices, infrastructure, and solutions. With more than 71,500 employees doing business in 180 markets, we help millions—not just the select few—experience our version of a smarter future. The one missing thing? Well… you... We are looking for Bachelor / Master's Degree fresh graduate to join us which is the role responsibility below : 1. Excellent work attitude and tenacity is essential to job execution 2. Well known about Intel/AMD platforms architecture. Arm/nVidia is a plus. 3. Insight to study new technology on advanced bus, chipset, cable, connector. 4. Familiar with high speed buses electrical spec and design especially on PCIe Gen5/DDR5, et cetera. 5. Familiar with low speed buses simulation and correlation (i.e. I2C/I3C/ESPI...). 6. Familiar with Polar, IMLC, IMADC, ICAT, ADS, Hspice, PowerDC, PowerSI/SIWave, Clarity/HFSS, SigXplorer, Seasim, S2eye. 7. 3D simulation capability to find out optimized design on specific area. 8. Placement discussion/implementation 9. Stackup design including PCB material and copper foil selection 10. Routing rules creation 11. Capability on board file and CM review. Knowing constraint setting is a plus. 12. Familiar with VNA operation 13. Debug on signal integrity issues 14. Possess excellent integration capabilities, gather team's opinion, simplify debug or specific event processing, and express logically in email or presentation for the other party to grasp information shortly. Requirements : - 具有對線路設計專業知識 - 對解決問題有熱誠 - 電子,電機系(所)及機電相關科系(所)的在屆畢業生并能在2024年8月前入職 | 月薪64,000~70,000元 | 台北市南港區 | |
硬體測試工程師 (2025新鮮人招募) | Here at Lenovo, we believe in smarter technology that builds a brighter, more sustainable, and inclusive future for our customers, colleagues, communities, and the planet. And we go big. No, not big—huge. We’re not just a US$70 billion revenue Fortune Global 500 company, we’re one of Fortune’s Most Admired. We’re transforming the world through intelligent transformation, offering the world’s most complete portfolio of smart devices, infrastructure, and solutions. With more than 71,500 employees doing business in 180 markets, we help millions—not just the select few—experience our version of a smarter future. The one missing thing? Well… you... Are you ready to kickstart your career as a Server Hardware Test Engineer? Join our team and focus on validating server hardware designs, analyzing new features, and ensuring our products meet high standards. As a fresh graduate, you'll have the chance to develop your skills in creating system hardware validation environments and learning advanced tools like emulation and platform-level testing. In this role, you'll: 1. Perform integrated tests on server systems, including Function, RAS, Stress, OS tests, and more. 2. Assist in developing test cases and Standard Operating Procedures (SOPs) based on product specifications. 3. Gain exposure to supplier test methodologies and contribute to test requirement definitions. 4. Learn hands-on testing execution processes and contribute to automation test case design. 5. Analyze defects and participate in corrective action processes, gaining insights into hardware failure modes. Position Requirements: 1. Recent graduate (0-1 year of experience) in Electrical Engineering, Computer Science, Mechanical Engineering, or related fields. 2. Basic understanding of Intel/AMD platform testing concepts is advantageous. 3. Academic or project experience in hardware validation or design is a plus. 4. Interest in learning about Server Hardware Design and validation processes. 5. Strong analytical skills, attention to detail, and effective communication abilities. Ready to embark on a rewarding career journey with us? Apply today and grow with our dynamic team! | 月薪64,000~70,000元 | 台北市南港區 | |
RAID engineer (2025 新鮮人招募) | Job Description: As a Storage Subsystem Engineer, you will be part of a dynamic team responsible for designing and implementing cutting-edge RAID/HBA/Backplane technologies. This role offers an excellent opportunity for fresh graduates to develop their skills and contribute to innovative storage solutions. Key Responsibilities: 1. Technology Research: Study and track new RAID/HBA/Backplane technologies in the industry to align with Lenovo's storage subsystem strategy. 2. Collaborative Design: Work with cross-functional teams to design RAID/HBA/Backplane Switch subsystem solutions, including management features. Define design specifications. 3. Implementation and Testing: Collaborate with ecosystem partners to implement design solutions. Create test plans, execute tests, report results, debug defects, and improve test plans and debugging skills. 4. Issue Resolution: Resolve design issues to meet quality, schedule, and cost requirements. 5. Technical Support: Provide end-to-end technical support throughout the adapter's lifecycle, including consulting on customer requirements and addressing manufacturing and field product design issues. 6. Documentation: Produce relevant technical documentation. Qualifications: 1. Bachelor's degree in Computer Science, Electrical Engineering, or a related field. 2. Strong analytical and problem-solving skills. 3. Excellent communication and teamwork abilities. 4. Eagerness to learn and adapt to new technologies. | 待遇面議 | 台北市南港區 | |
Shock/Vibration & Packaging Engineer (2025 新鮮人招募) | We are Lenovo. We do what we say. We own what we do. We WOW our customers. Lenovo is a US$57 billion revenue global technology powerhouse, ranked #248 in the Fortune Global 500, and serving millions of customers every day in 180 markets. Focused on a bold vision to deliver Smarter Technology for All, Lenovo has built on its success as the world’s largest PC company with a full-stack portfolio of AI-enabled, AI-ready, and AI-optimized devices (PCs, workstations, smartphones, tablets), infrastructure (server, storage, edge, high performance computing and software defined infrastructure), software, solutions, and services. Lenovo’s continued investment in world-changing innovation is building a more equitable, trustworthy, and smarter future for everyone, everywhere. Lenovo is listed on the Hong Kong stock exchange under Lenovo Group Limited (HKSE: 992) (ADR: LNVGY). This transformation together with Lenovo’s world-changing innovation is building a more inclusive, trustworthy, and smarter future for everyone, everywhere. To find out more visit www.lenovo.com, and read about the latest news via our StoryHub. We are looking for a Bachelor / Master's Degree graduate to join us which is the role responsibilities below : 1. Plan and execute reliability testing via structure equipment (Shock Table, Vibration Table, Package Drop Machine, spectrum analyzer and relative equipment, etc…). Validation test support includes material preparation, system setup, schedule tracking. 2. Develop protective packaging solutions for Lenovo ISG products including cushions and corrugated designs. 3. Troubleshoot new and existing packaging problems involving designs, materials, and processes and provide creative, timely, and cost-effective solutions. 4. Laboratory regular management and facility maintenance. 5. Lab documents (SOP/WI) maintenance and up-to-date. 6. Participate with NPI and development teams to support new product introduction. 7. Work with global MFG locations to facilitate packaging introductions and process improvements. 8. Work with global suppliers to introduce new designs, materials, and maintain supplier packaging quality. 9. Identify and implement cost savings initiatives related to packaging materials, transportation, and process efficiency. Requirement: Bachelor's degree in packaging/mechanical engineering. | 月薪64,000~70,000元 | 台北市南港區 |
BIOS Engineer 林昱叡
Graphic Designer 李若虔
BMC Engineer Gary Lee